SVTC Technologies, a partner for accelerating nanotechnology development and commercialization, is partnering with SUSS MicroTec, an equipment supplier for MEMS and advanced 3D IC integration. This collaboration is targeted at supporting wafer-level processing for MEMS and 3D IC integration with focus on the newest bonding applications needed for next-generation electronics. The partnership with SUSS MicroTec continues an ongoing SVTC strategy to provide an ecosystem of partners all geared towards providing comprehensive value-added solutions to customers.

“Our partnership with SVTC will focus on developing new processes and solutions in the field of wafer-level packaging.  We are looking forward to this promising liaison that extends the value proposition we offer to our customers, today and tomorrow," said Frank P. Averdung, president and CEO, SUSS MicroTec AG. 

SUSS MicroTec has consigned alignment and bonding equipment to one of SVTC’s state-of-the-art 24/7 cleanrooms located in San Jose, California.  The collaboration between the two companies will allow mutual customers to test out equipment and develop new processes without interfering with their own manufacturing flows. This partnership will also enable the two companies to jointly develop and characterize new lithography and wafer-bonding technologies.

SVTC Technologies provides a complete range of solutions through in-house capabilities and a select network of strategic partners.  Based on years of hands-on, collaborative experience, SVTC has assembled an ecosystem of valued partners that complements SVTC’s capabilities to provide a broad array of technology development services.